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Search for "Cu/Au" in Full Text gives 10 result(s) in Beilstein Journal of Nanotechnology.

Plasmonic nanotechnology for photothermal applications – an evaluation

  • A. R. Indhu,
  • L. Keerthana and
  • Gnanaprakash Dharmalingam

Beilstein J. Nanotechnol. 2023, 14, 380–419, doi:10.3762/bjnano.14.33

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  • . When the energy of the photons is greater than the bandgap, interband transitions are observed. As an example of the energies at which interband transitions [28] occur, Cu, Au, Ag exhibit them at 2.25, 2.4, and 4 eV, respectively, and threshold energy levels of interband transitions are 1.6–1.8 eV for
  • Cu, Au, and Al, as well as 3.5 eV for Ag [29]. Concerning PT applications, radiative transitions such as luminescence and scattering imply inefficiency, as this scattered energy is not converted to heat. Hot electron generation and subsequent thermalization are consequences of SPR absorption that can
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Published 27 Mar 2023

Uniform arrays of gold nanoelectrodes with tuneable recess depth

  • Elena O. Gordeeva,
  • Ilya V. Roslyakov,
  • Alexey P. Leontiev,
  • Alexey A. Klimenko and
  • Kirill S. Napolskii

Beilstein J. Nanotechnol. 2021, 12, 957–964, doi:10.3762/bjnano.12.72

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  • of Cu/Au/Cu segments into the pores of an anodic alumina template with the subsequent selective dissolution of the sputtered Cu current collector and the first Cu segment. The reported design of NEAs allows one to tune the recess of Au nanoelectrodes relative to the AAO surface with high precision
  • collector and the first Cu segment. Cross-sectional SEM images of AAO/Cu/Au/Cu nanocomposite, schematically shown in panel (c), illustrating the full thickness of the template (e) and the bottom part with two short segments of Cu and Au (f). Electrochemical responses recorded during the electrodeposition of
  • the third Cu segment: (a) j–t curves and (b) j–q curves. Characteristic stages of the templated electrodeposition are indicated in panel (a) on the example of the current transient recorded at Ed = −0.1 V. Cross-sectional SEM images of the AAO/Cu/Au/Cu nanocomposites obtained at different deposition
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Published 30 Aug 2021

The role of gold atom concentration in the formation of Cu–Au nanoparticles from the gas phase

  • Yuri Ya. Gafner,
  • Svetlana L. Gafner,
  • Darya A. Ryzkova and
  • Andrey V. Nomoev

Beilstein J. Nanotechnol. 2021, 12, 72–81, doi:10.3762/bjnano.12.6

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  • 10.3762/bjnano.12.6 Abstract The synthesis of bimetallic nanoparticles need to be controlled in order to obtain particles of a desired size, spatial structure, and chemical composition. In the synthesis of the CuAu nanoparticles studied here, nanoparticles can be obtained through either chemical or
  • composition; however, the size of the resulting particles varies significantly. To solve this issue, we studied the formation of CuAu nanoparticles with different chemical compositions from a gaseous medium using computer molecular dynamics (MD) simulation. The aim was to determine the effect of the
  • initial vapor phase, basically corresponded to a given target composition. Keywords: binary nanoparticles; computer simulation; copper; gold; molecular dynamics; Introduction The nanometer-sized CuAu compounds are being studied quite actively [1][2][3][4][5][6][7][8] because of their potential
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Published 19 Jan 2021

Sputtering of silicon nanopowders by an argon cluster ion beam

  • Xiaomei Zeng,
  • Vasiliy Pelenovich,
  • Zhenguo Wang,
  • Wenbin Zuo,
  • Sergey Belykh,
  • Alexander Tolstogouzov,
  • Dejun Fu and
  • Xiangheng Xiao

Beilstein J. Nanotechnol. 2019, 10, 135–143, doi:10.3762/bjnano.10.13

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  • depth shows linear dependence on the cluster ion dose [8][12][13]. The energy dependence of the sputtering yield of Ag, Cu, Au, and Si exhibits a linear or ultralinear behavior [8][14][15]. In both cases, the energy threshold of 3–6 keV is observed. This value correlates with the surface binding energy
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Published 10 Jan 2019

Comparative study of antibacterial properties of polystyrene films with TiOx and Cu nanoparticles fabricated using cluster beam technique

  • Vladimir N. Popok,
  • Cesarino M. Jeppesen,
  • Peter Fojan,
  • Anna Kuzminova,
  • Jan Hanuš and
  • Ondřej Kylián

Beilstein J. Nanotechnol. 2018, 9, 861–869, doi:10.3762/bjnano.9.80

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  • organic cells. Because of these toxic properties the films and nanostructures of such metals or metal compounds are widely used as antibacterial and antimicrobial agents. Among them are Ag, Cu, Au, CuO, ZnO, Fe3O4, Al2O3 and TiO2, to name just a few [1][2][3]. They all exhibit bactericidal properties
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Published 12 Mar 2018

Polymer blend lithography for metal films: large-area patterning with over 1 billion holes/inch2

  • Cheng Huang,
  • Alexander Förste,
  • Stefan Walheim and
  • Thomas Schimmel

Beilstein J. Nanotechnol. 2015, 6, 1205–1211, doi:10.3762/bjnano.6.123

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  • lithography method has been used to study the surface plasmonics of random nano-hole arrays in metal films [26][27]. Since the skin depth, and therefore the transmission of thin films, of Cu, Au and Ag is relatively high, we selected aluminum, which shows a high reflectivity in the range of 220 to 650 nm
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Published 26 May 2015

Stick–slip behaviour on Au(111) with adsorption of copper and sulfate

  • Nikolay Podgaynyy,
  • Sabine Wezisla,
  • Christoph Molls,
  • Shahid Iqbal and
  • Helmut Baltruschat

Beilstein J. Nanotechnol. 2015, 6, 820–830, doi:10.3762/bjnano.6.85

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  • obtained at the solid/gas interface are also valid at the solid electrolyte interface. In this paper we present the results of investigations of friction forces during UPD and dissolution of Cu/Au(111) and also during sulfate adsorption in sulfuric acid solution. We extend previous measurements to lower
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Published 26 Mar 2015

Formation of CuxAu1−x phases by cold homogenization of Au/Cu nanocrystalline thin films

  • Alona Tynkova,
  • Gabor L. Katona,
  • Gabor A. Langer,
  • Sergey I. Sidorenko,
  • Svetlana M. Voloshko and
  • Dezso L. Beke

Beilstein J. Nanotechnol. 2014, 5, 1491–1500, doi:10.3762/bjnano.5.162

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  • , Hungary 10.3762/bjnano.5.162 Abstract It is shown, by using depth profiling with a secondary neutral mass spectrometer and structure investigations by XRD and TEM, that at low temperatures, at which the bulk diffusion is frozen, a complete homogenization can take place in the Cu/Au thin film system
  • using a simple model the interface velocity in both the Cu and Au layers were estimated from the linear increase of the average composition and its value is about two orders of magnitude larger in Au (ca. 10−11 m/s) than in Cu (ca. 10−13 m/s). Keywords: Cu/Au; grain boundary diffusion; nanofilms of
  • still existed in the heat-treated samples and, similarly to the results of [8] in Cu/Pd, the early stages in Cu/Au could not be understood as a planar layer reaction. It was also observed that new grains were formed in the reaction zone (DIR). While in [7] the main phenomenon was the relaxation of
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Published 10 Sep 2014

Catalytic activity of nanostructured Au: Scale effects versus bimetallic/bifunctional effects in low-temperature CO oxidation on nanoporous Au

  • Lu-Cun Wang,
  • Yi Zhong,
  • Haijun Jin,
  • Daniel Widmann,
  • Jörg Weissmüller and
  • R. Jürgen Behm

Beilstein J. Nanotechnol. 2013, 4, 111–128, doi:10.3762/bjnano.4.13

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Published 19 Feb 2013
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  • contact with a copper ring accessible to external electronic equipment (voltage supply or potentiostat). In some cases, the thin conductive Au layer is reinforced electrochemically by a metal layer (e.g., Cu, Au) in a two electrode configuration (Figure 5b). After reinforcement, the electrolyte is removed
  • nanowires reach the top side of the porous membrane, the deposition continues outside the pores forming so-called caps (Figure 6a, zone 3). The shape and morphology of the caps are a direct indication of the crystalline structure of the wires as shown for various materials (e.g., Cu, Au, Bi, Sb). Round caps
  • fabrication of a single-pore membrane by ion irradiation and etching; (b) deposition of a suitable substrate; (c) electrochemical growth of a single nanowire (e.g., Cu, Au, Bi) and continuation of the deposition process until a micrometre-sized cap grows on top of the wire; and (d) contacting of the embedded
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Published 17 Dec 2012
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