Cite the Following Article
Bending and punching characteristics of aluminum sheets using the quasi-continuum method
Man-Ping Chang, Shang-Jui Lin and Te-Hua Fang
Beilstein J. Nanotechnol. 2022, 13, 1303–1315.
https://doi.org/10.3762/bjnano.13.108
How to Cite
Chang, M.-P.; Lin, S.-J.; Fang, T.-H. Beilstein J. Nanotechnol. 2022, 13, 1303–1315. doi:10.3762/bjnano.13.108
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- Nguyen, H.-G.; Wu, M.-J.; Fang, T.-H. Study on copper-to-copper bonding of three-dimensional integrated circuits using the quasicontinuum method. Physica Scripta 2024, 99, 65114–065114. doi:10.1088/1402-4896/ad46cd
