First-principles study on elastic properties of Cu, (Cu1−x,Nix)3Sn and interfacial mechanical properties of (Cu1−x,Nix)3Sn/Cu in the lead-free solder joint

Guomin Hua
Beilstein J. Nanotechnol. 2026, 17, 428–439. https://doi.org/10.3762/bjnano.17.29

Cite the Following Article

First-principles study on elastic properties of Cu, (Cu1−x,Nix)3Sn and interfacial mechanical properties of (Cu1−x,Nix)3Sn/Cu in the lead-free solder joint
Guomin Hua
Beilstein J. Nanotechnol. 2026, 17, 428–439. https://doi.org/10.3762/bjnano.17.29

How to Cite

Hua, G. Beilstein J. Nanotechnol. 2026, 17, 428–439. doi:10.3762/bjnano.17.29

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