Cite the Following Article
First-principles study on elastic properties of Cu, (Cu1−x,Nix)3Sn and interfacial mechanical properties of (Cu1−x,Nix)3Sn/Cu in the lead-free solder joint
Guomin Hua
Beilstein J. Nanotechnol. 2026, 17, 428–439.
https://doi.org/10.3762/bjnano.17.29
How to Cite
Hua, G. Beilstein J. Nanotechnol. 2026, 17, 428–439. doi:10.3762/bjnano.17.29
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