1 article(s) from DiFalco, Andrea
(a) Scheme of SAM controlled electrodeposition and lift-off of metal structures. Starting from a un...
Jump to Figure 1
(a) Illustration of different types of defects in a SAM. Domain boundaries (1) and substrate steps ...
Jump to Figure 2
Linear-sweep voltammograms comparing the electrodeposition of Cu on clean (black squares) and SAM m...
Jump to Figure 3
(a,b) Chronoamperograms of single potential (a) and double potential (b) deposition processes on a ...
Jump to Figure 4
SEM images of Cu nucleation and growth on a MBP0-SAM on Au/Ag/Mica prepared at 65 °C for 24 h. (a) ...
Jump to Figure 5
Electrochemical deposition of Cu on e-beam-patterned MBP0-SAM/Au/Si. (a) SEM image of a series of p...
Jump to Figure 6
SEM images of a SAM templated copper deposit on the original MBP0 coated Au/Si substrate (a) and af...
Jump to Figure 7
AFM topography images of Cu electrodeposited onto an e-beam-patterned MBP0-SAM on Au/Si (a) before ...
Jump to Figure 8
AFM images of Cu electrodeposition onto a MBP0/Au/Si sample demonstrating the quality of passivatio...
Jump to Figure 9
(a,b) AFM topography images and height profiles along the lines indicated, comparing the roughness ...
Jump to Figure 10
Beilstein J. Nanotechnol. 2012, 3, 101–113, doi:10.3762/bjnano.3.11
Subscribe to our Latest Articles RSS Feed.
Register and get informed about new articles.
Follow the Beilstein-Institut