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1 article(s) from Hua, Guomin

First-principles study on elastic properties of Cu, (Cu₁₋_x,Ni_x)₃Sn and interfacial mechanical properties of (Cu₁₋_x,Ni_x)₃Sn/Cu in the lead-free solder joint

Guomin Hua

Beilstein J. Nanotechnol. 2026, 17, 428–439, doi:10.3762/bjnano.17.29

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Published 19 Mar 2026

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