Beilstein J. Nanotechnol.2012,3, 52–56, doi:10.3762/bjnano.3.6
vacuum (UHV), to be used effectively. While the suite of established vacuumdeposition technologies is vast and capable of highly precise deposition, there are relatively few methods to perform additive lithography in a single deposition step. Additive lithography deposits only the material that is
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Figure 1:
(a) Schematic of the tDPN process which uses a heated scanning probe microscope tip to deposit poly...
Beilstein J. Nanotechnol.2010,1, 3–13, doi:10.3762/bjnano.1.2
, rinsed three times with water followed by ethanol and dried in air. The upper sides of microcantilevers were coated with a 2 nm-layer of Ti followed by a 25 nm thick Au layer without breaking the vacuum. Deposition of metal layers was performed in an EVA 300 electron beam evaporator (Alliance Concept
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Figure 1:
(A) Scanning electron microscope image of a silicon microcantilever array consisting of eight canti...