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Search for "lithography" in Full Text gives 303 result(s) in Beilstein Journal of Nanotechnology. Showing first 200.

Experimental and theoretical study of field-dependent spin splitting at ferromagnetic insulator–superconductor interfaces

  • Peter Machon,
  • Michael J. Wolf,
  • Detlef Beckmann and
  • Wolfgang Belzig

Beilstein J. Nanotechnol. 2022, 13, 682–688, doi:10.3762/bjnano.13.60

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  • a Si(111) substrate heated to 800 °C. In a second fabrication step, aluminium/aluminium oxide/copper tunnel junctions were fabricated on the EuS film using e-beam lithography and shadow evaporation. The nominal aluminium film thickness was d = 10 nm. The differential conductance g = dI/dV of the
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Published 20 Jul 2022

Tunable high-quality-factor absorption in a graphene monolayer based on quasi-bound states in the continuum

  • Jun Wu,
  • Yasong Sun,
  • Feng Wu,
  • Biyuan Wu and
  • Xiaohu Wu

Beilstein J. Nanotechnol. 2022, 13, 675–681, doi:10.3762/bjnano.13.59

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  • traditional lithography, and then employ the conventional wet-base transfer method to transfer a CVD-grown graphene monolayer onto the grating structure. Conclusion In summary, an active graphene absorber, consisting of a graphene monolayer and a substrate spaced by a dielectric grating, is proposed and
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Published 19 Jul 2022

Fabrication and testing of polymer microneedles for transdermal drug delivery

  • Vahid Ebrahiminejad,
  • Zahra Faraji Rad,
  • Philip D. Prewett and
  • Graham J. Davies

Beilstein J. Nanotechnol. 2022, 13, 629–640, doi:10.3762/bjnano.13.55

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  • multistage fabrication processes with high production costs [7]. Similarly, laser ablation and lithography techniques are costly, requiring extended production time [8]. To overcome the current manufacturing limitations, MNs might be fabricated cost-effectively, with high precision and accuracy, using 3D
  • photoresist was drop cast onto an indium tin oxide (ITO) glass substrate prior to starting the printing process. A dip-in laser lithography (DiLL) objective (25× magnification, NA = 0.8) was used for printing, after which the MN array was washed in propylene glycol methyl ether acetate (PGMEA) for 10 minutes
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Published 08 Jul 2022

Zinc oxide nanostructures for fluorescence and Raman signal enhancement: a review

  • Ioana Marica,
  • Fran Nekvapil,
  • Maria Ștefan,
  • Cosmin Farcău and
  • Alexandra Falamaș

Beilstein J. Nanotechnol. 2022, 13, 472–490, doi:10.3762/bjnano.13.40

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  • ordered hybrid nanostructured substrates, ranging from more expensive and laborious ones, such as pulsed laser deposition or hydrothermal growth, followed by sputtering processes [31] or electron beam lithography to more cost-efficient and simple ones, such as photochemical deposition of metallic NPs or a
  • metallic layer [32], chemical synthesis [33], or nanosphere lithography. Usually, ZnO nanostructures are fabricated first, followed by the decoration with metallic nanostructures or a metallic layer, which is added by physical vapour deposition, including sputtering processes [6][34], ion sputtering, which
  • needed to develop efficient SERS substrates. The combination of several methods including nanosphere lithography, atomic layer deposition, electrodeposition, and electron-beam evaporation resulted in Au-covered hollow urchin-like ZnO structures (Figure 2e–k) [16]. The ZnO layer was deposited on a
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Published 27 May 2022

Investigation of electron-induced cross-linking of self-assembled monolayers by scanning tunneling microscopy

  • Patrick Stohmann,
  • Sascha Koch,
  • Yang Yang,
  • Christopher David Kaiser,
  • Julian Ehrens,
  • Jürgen Schnack,
  • Niklas Biere,
  • Dario Anselmetti,
  • Armin Gölzhäuser and
  • Xianghui Zhang

Beilstein J. Nanotechnol. 2022, 13, 462–471, doi:10.3762/bjnano.13.39

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  • role in science and technology. A highly focused electron beam is employed to create nanostructures via electron-beam lithography [1], and has been further developed to produce three-dimensional structures through controlled dissociation of precursor molecules [2]. Electron-induced chemistry has also
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Published 25 May 2022

Micro- and nanotechnology in biomedical engineering for cartilage tissue regeneration in osteoarthritis

  • Zahra Nabizadeh,
  • Mahmoud Nasrollahzadeh,
  • Hamed Daemi,
  • Mohamadreza Baghaban Eslaminejad,
  • Ali Akbar Shabani,
  • Mehdi Dadashpour,
  • Majid Mirmohammadkhani and
  • Davood Nasrabadi

Beilstein J. Nanotechnol. 2022, 13, 363–389, doi:10.3762/bjnano.13.31

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Published 11 Apr 2022

Impact of device design on the electronic and optoelectronic properties of integrated Ru-terpyridine complexes

  • Max Mennicken,
  • Sophia Katharina Peter,
  • Corinna Kaulen,
  • Ulrich Simon and
  • Silvia Karthäuser

Beilstein J. Nanotechnol. 2022, 13, 219–229, doi:10.3762/bjnano.13.16

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  • nanoelectrodes separated by gaps of 8 to 20 nm. They are fabricated by electron beam lithography (EBL) in a lift-off process while using a self-aligned Al2O3 hard mask to define the nanogap size [20][21]. The resulting nanoelectrode pairs are used for the on-chip preparation of Ru(TP)2-complex wires according to
  • using electron beam lithography and lift-off [21]. These nanoelectrode samples with gap sizes of 8 to 20 nm between the electrodes were used in order to fabricate Ru(TP)2-complex wire devices. According to the Ru-complex wire growth procedure described above, the samples were treated first with MPTP
  • lithography according to the recently developed routine that enables the assembly of the molecular building blocks on solid surfaces at room-temperature under mild conditions and, thus, represents an on-chip preparation method [19]. In parallel, the first steps of the consecutive wire growth on Au substrates
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Published 15 Feb 2022

Engineered titania nanomaterials in advanced clinical applications

  • Padmavati Sahare,
  • Paulina Govea Alvarez,
  • Juan Manual Sanchez Yanez,
  • Gabriel Luna-Bárcenas,
  • Samik Chakraborty,
  • Sujay Paul and
  • Miriam Estevez

Beilstein J. Nanotechnol. 2022, 13, 201–218, doi:10.3762/bjnano.13.15

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  • /titanium dioxide nanocomposites against biofilm-forming and methicillin-resistant strains of Staphylococcus aureus and Pseudomonas aeruginosa [95]. In another novel approach, dip pen nanolithography and soft lithography were used to form a micropattern of a silica sol modified with TiO2 (5% and 10
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Published 14 Feb 2022

Morphology-driven gas sensing by fabricated fractals: A review

  • Vishal Kamathe and
  • Rupali Nagar

Beilstein J. Nanotechnol. 2021, 12, 1187–1208, doi:10.3762/bjnano.12.88

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  • experimental approaches. Here, lithography techniques can be implemented to write fractals of different fractal dimensions and their response under identical test conditions can be studied. Such structures can also be explored as substrates for surface-enhanced Raman spectroscopy, which finds applications in
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Published 09 Nov 2021

Irradiation-driven molecular dynamics simulation of the FEBID process for Pt(PF3)4

  • Alexey Prosvetov,
  • Alexey V. Verkhovtsev,
  • Gennady Sushko and
  • Andrey V. Solov’yov

Beilstein J. Nanotechnol. 2021, 12, 1151–1172, doi:10.3762/bjnano.12.86

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  • . The methodology can also be adjusted to simulate the nanostructure formation by other nanofabrication techniques using electron beams, such as direct electron beam lithography. In the present study, the methodology is applied to the IDMD simulation of the FEBID of Pt(PF3)4, a widely studied precursor
  • , novel techniques exploiting the irradiation of nanosystems with collimated electron and ion beams have been developed [2][3]. One of these techniques is electron beam lithography (EBL), which is similar to conventional optical lithography but relies on the change of solubility after electron exposure of
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Published 13 Oct 2021

An overview of microneedle applications, materials, and fabrication methods

  • Zahra Faraji Rad,
  • Philip D. Prewett and
  • Graham J. Davies

Beilstein J. Nanotechnol. 2021, 12, 1034–1046, doi:10.3762/bjnano.12.77

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  • biotherapeutics, drugs, and vaccines through the skin. A wide range of microneedle structure, design, geometry, and microneedle array densities is manufactured using different rapid prototyping and microfabrication technologies such as deep reactive ion etching (DRIE) [2], lithography [3], hot embossing [4], and
  • injection moulding [61], wet chemical etching [75], reactive ion etching [2][76], hot embossing [4][5], laser drilling [77], lithography plus electroforming [78][79], drawing lithography [80][81], two-photon polymerization [5][82], and 3D printing [83][84]. To date, DRIE of silicon; micromoulding
  • ; photolithography; and Lithographie, Galvanoformung, Abformung or lithography, electroplating, moulding (LIGA), using deep X-ray lithography, are the most extensively used manufacturing technologies for microneedle fabrication, although fabrication of longer microneedles (>400 μm) is difficult with some of these
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Published 13 Sep 2021

Uniform arrays of gold nanoelectrodes with tuneable recess depth

  • Elena O. Gordeeva,
  • Ilya V. Roslyakov,
  • Alexey P. Leontiev,
  • Alexey A. Klimenko and
  • Kirill S. Napolskii

Beilstein J. Nanotechnol. 2021, 12, 957–964, doi:10.3762/bjnano.12.72

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  • direct-writing using electron beam lithography [11][12] or ion beam milling [13][14]) are limited by the ensemble area and expensive in mass production, but allow one to precisely tune the parameters of an array (a geometry of individual electrodes and the distance between them) over a wide range. An
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Published 30 Aug 2021

The role of convolutional neural networks in scanning probe microscopy: a review

  • Ido Azuri,
  • Irit Rosenhek-Goldian,
  • Neta Regev-Rudzki,
  • Georg Fantner and
  • Sidney R. Cohen

Beilstein J. Nanotechnol. 2021, 12, 878–901, doi:10.3762/bjnano.12.66

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Published 13 Aug 2021

A review of defect engineering, ion implantation, and nanofabrication using the helium ion microscope

  • Frances I. Allen

Beilstein J. Nanotechnol. 2021, 12, 633–664, doi:10.3762/bjnano.12.52

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  • ; focused helium ion beam-induced deposition; focused helium ion beam milling; helium ion beam lithography; helium ion implantation; Introduction Since the helium ion microscope (HIM) was introduced 15 years ago [1][2][3], over one hundred HIMs have been installed worldwide and over one thousand research
  • also lead to a nanofabrication outcome. For example, localized swelling by ion implantation can be used to pattern nanoscale surface topographies, ion-induced collisional mixing can restructure buried interfaces, and ion-induced chemical changes can be used for resist-based lithography. In the
  • following, the field of materials modification research using the HIM is reviewed, subdivided into the following areas: 1. defect engineering, 2. ion implantation, 3. irradiation-induced restructuring, 4. resist-based lithography, 5. direct-write lithography/milling (including gas-assisted milling), and 6
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Published 02 Jul 2021

On the stability of microwave-fabricated SERS substrates – chemical and morphological considerations

  • Limin Wang,
  • Aisha Adebola Womiloju,
  • Christiane Höppener,
  • Ulrich S. Schubert and
  • Stephanie Hoeppener

Beilstein J. Nanotechnol. 2021, 12, 541–551, doi:10.3762/bjnano.12.44

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  • on the substrates [8], the synthesis of complex nanoparticle structures with tunable interparticle gap sizes [9], the utilization of micro- and nanofabricated structures obtained by lithography techniques [10][11][12] comprising nanodisk arrays [13], nanoholes [14][15], nanocups [16][17
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Published 11 Jun 2021

Exploring the fabrication and transfer mechanism of metallic nanostructures on carbon nanomembranes via focused electron beam induced processing

  • Christian Preischl,
  • Linh Hoang Le,
  • Elif Bilgilisoy,
  • Armin Gölzhäuser and
  • Hubertus Marbach

Beilstein J. Nanotechnol. 2021, 12, 319–329, doi:10.3762/bjnano.12.26

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  • 3.0 × 10−7 mbar, this corresponds to a local pressure at the surface of about 9 × 10−6 mbar [37]. All electron exposures for SEM and lithography were performed at a beam energy of 15 kV and probe currents of 400 pA and 3 nA, respectively. The lithographic processes were controlled via a self-developed
  • lithography application based on LabView 8.6 (National Instruments) and a high-speed DAC PCIe card (M2i.6021-exp, Spectrum GmbH, Germany). SEM images were acquired with SmartSEM (Zeiss) and are shown with minor contrast and brightness adjustments only. For Auger electron spectroscopy the electron beam of the
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Published 07 Apr 2021

The patterning toolbox FIB-o-mat: Exploiting the full potential of focused helium ions for nanofabrication

  • Victor Deinhart,
  • Lisa-Marie Kern,
  • Jan N. Kirchhof,
  • Sabrina Juergensen,
  • Joris Sturm,
  • Enno Krauss,
  • Thorsten Feichtner,
  • Sviatoslav Kovalchuk,
  • Michael Schneider,
  • Dieter Engel,
  • Bastian Pfau,
  • Bert Hecht,
  • Kirill I. Bolotin,
  • Stephanie Reich and
  • Katja Höflich

Beilstein J. Nanotechnol. 2021, 12, 304–318, doi:10.3762/bjnano.12.25

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  • by measuring the bright optical modes [59]. The target geometry for all fabrication techniques is a particle radius of 45 nm with a gap size of 35 nm. This is the geometry that can reliably fabricated by resist-based electron beam lithography on physically sputtered gold layers (cf. Figure 7a). Later
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Published 06 Apr 2021

Gold(I) N-heterocyclic carbene precursors for focused electron beam-induced deposition

  • Cristiano Glessi,
  • Aya Mahgoub,
  • Cornelis W. Hagen and
  • Mats Tilset

Beilstein J. Nanotechnol. 2021, 12, 257–269, doi:10.3762/bjnano.12.21

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  • and some volatile fragments. The technique has been employed in applications such as the fabrication of nanoconnectors [5], extreme ultra-violet lithography (EUVL) mask repair [6], AFM probe tips [7][8][9], nanodevices for plasmonics [10], gas sensors [11][12], optoelectronics [13], and magnetic [14
  • ][15] and biomedical applications [16]. FEBID provides a flexible direct-write technique to fabricate complex 3D structures, which are hard to realize using resist-based planar lithography processes. However, when using organometallic precursors, usually, undesired dissociation fragments also end up in
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Published 17 Mar 2021

Scanning transmission helium ion microscopy on carbon nanomembranes

  • Daniel Emmrich,
  • Annalena Wolff,
  • Nikolaus Meyerbröker,
  • Jörg K. N. Lindner,
  • André Beyer and
  • Armin Gölzhäuser

Beilstein J. Nanotechnol. 2021, 12, 222–231, doi:10.3762/bjnano.12.18

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  • established as a key nanofabrication tool for milling [7][8][9], defect engineering [10][11], and resist-based lithography [12][13], overcoming the resolution limitations of other FIB techniques [14][15]. Both bulk samples as well as thin membranes have been structured using the HIM. On membranes, the sputter
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Published 26 Feb 2021

A review on the green and sustainable synthesis of silver nanoparticles and one-dimensional silver nanostructures

  • Sina Kaabipour and
  • Shohreh Hemmati

Beilstein J. Nanotechnol. 2021, 12, 102–136, doi:10.3762/bjnano.12.9

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  • ], lithography [120][121], spray pyrolysis [122][123][124], radiolysis [125][126][127][128], arc discharge [129][130][131][132][133], and photoirradiation [134][135][136] have been utilized to synthesize various morphologies of silver nanostructures with varied size and size distribution. The physical synthesis
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Published 25 Jan 2021

Piezotronic effect in AlGaN/AlN/GaN heterojunction nanowires used as a flexible strain sensor

  • Jianqi Dong,
  • Liang Chen,
  • Yuqing Yang and
  • Xingfu Wang

Beilstein J. Nanotechnol. 2020, 11, 1847–1853, doi:10.3762/bjnano.11.166

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  • lithography was used to form a striped pattern, which was used as a mask for ICP dry etching. The depth of the ICP dry etching needs to be greater than 1 µm (the thickness of the AlGaN/AlN/GaN heterojunction is 931.5 nm). The purpose is to expose the sacrificial layer for the subsequent EC wet etching. Then
  • , the striped photoresist mask, which covers the surface, was removed with acetone to obtain the structure shown in Figure 2a. The settings for the stripe width (900 nm) and the interval between the stripes (3 μm) were controlled during stepper lithography. After ICP dry etching, the sample was placed
  • suitable applied electric field, the mechanism of EC etching can be described by: The corresponding SEM images are shown in Figure 2d–f. After ICP dry etching, a regular stripe array was formed (Figure 2d) and the shape of the NWs was controlled in advance during stepper lithography. Because of its high
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Published 10 Dec 2020

Absorption and photoconductivity spectra of amorphous multilayer structures

  • Oxana Iaseniuc and
  • Mihail Iovu

Beilstein J. Nanotechnol. 2020, 11, 1757–1763, doi:10.3762/bjnano.11.158

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  • ; photocurrent; transmission spectra; Introduction The As–S–Se, Ge–As–Se, and Ge–As–S ternary glass systems currently attract a lot of attention because of their wide application in IR optics, non-linear optics, photonics, optoelectronics, and as recording media for holography and e-beam lithography [1][2][3
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Published 20 Nov 2020

Imaging and milling resolution of light ion beams from helium ion microscopy and FIBs driven by liquid metal alloy ion sources

  • Nico Klingner,
  • Gregor Hlawacek,
  • Paul Mazarov,
  • Wolfgang Pilz,
  • Fabian Meyer and
  • Lothar Bischoff

Beilstein J. Nanotechnol. 2020, 11, 1742–1749, doi:10.3762/bjnano.11.156

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  • resolution. This mass range is of interest due to the interaction of the ions with the near-surface region and, among other use cases, the application of these ions for indirect or resist-aided lithography [3]. The introduction of the helium ion microscope (HIM) [4], working with a gas field ion source (GFIS
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Published 18 Nov 2020

Functional nanostructures for electronics, spintronics and sensors

  • Anatolie S. Sidorenko

Beilstein J. Nanotechnol. 2020, 11, 1704–1706, doi:10.3762/bjnano.11.152

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  • technology including lift-off electron-beam lithography followed by ultra-high-vacuum deposition of materials that was used for fabrication of nanostructured quasi-1D chains of Josephson junctions. This was followed by the work of Mohammed et al. [12] who presented a smart vacuum technology for the design of
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Published 10 Nov 2020

Out-of-plane surface patterning by subsurface processing of polymer substrates with focused ion beams

  • Serguei Chiriaev,
  • Luciana Tavares,
  • Vadzim Adashkevich,
  • Arkadiusz J. Goszczak and
  • Horst-Günter Rubahn

Beilstein J. Nanotechnol. 2020, 11, 1693–1703, doi:10.3762/bjnano.11.151

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  • the basis of a comparative study of the role of material-related factors in the FIB-induced surface patterning. PMMA and PC polymers are especially interesting for many reasons: PMMA is widely used as a positive resist for X-ray, deep UV [8], electron and ion-beam lithography [9]. Structural
  • PMMA, it has a much higher mechanical toughness, thermal resistance, chemical stability, and as PMMA, it is widely used in optical applications. A range of publications show that, owing to its radiation susceptibility, PC can be used as a positive or negative resist for electron beam lithography [15
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Published 06 Nov 2020
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